Domestic Quick Turn, Prototype, and High Volume Assembly

• Multi-chip Module ⁄ Monolithic
• Three Clean Rooms
• Class 100
• Class 1000
• Class 10,000
• Die Material - Silicon, SOS, GaAs, SiC
• Wafer Processing
• Disco Dicing equipment
• Cut range up to 8" or 200mm DIA
• Die sorting – automatic pick and place
• Wafer maps converted/uploaded to ALPS for binning, sorting to gel pack, waffle pack, or directly packaged
• Automatic Die Attach - JM7000
• Eutectic
• Epoxy
• Solder
• Auto/Manual Wire Bonding
• K&S and F&K Delvotec automatic wire bonders
• 0.7 to 3.0 mil Aluminum Ultrasonic
• 0.7 to 2.0 mil Gold Thermo sonic
• Bond Pull –Destruct / Non Destruct
• Hermetic Seal
• Gold-tin eutectic solder reflow
• Parallel Seam Seal
• Resistance welding – TO packages
• Glass frit seal
• Solder Re-flow
• Vacuum Bake
• Lead Trim/Form