Custom Products
CUSTOM PRODUCT CAPABILITES
Micross Components (formerly Austin Semiconductor) has loyally served the Military & Hi-Rel custom assembly and test marketplace for over 22 years. Custom support has been the company foundation since its inception, with the philosophy that if it can be defined by the customer, Micross will support the RFQ.
No semiconductor device is too simple or too complex, as the products supported over the years have spanned from diodes to Giga-bit 800Mhz memory devices. Micross Components also consistently attends to the special high reliability process and ceramic packaging interest of the satellite and space community.
Micross has always striven for high quality standards in serving space customers, having achieved class 'V' for MIL-PRF-38535 and currently pursuing Class 'K' for MIL-PRF-38534. In fact, Micross was the first non-OEM company QML certified by DSCC. This tradition of quality standard has formed the pillars of Micross success in this unique and special custom marketplace.
PRODUCT FLYER
Click here to view our Custom Product Capabilities Flyer.
PRODUCT OFFERING/CAPABILITIES
- STANDARD MEMORY PRODUCTS
(Monolithic & Modules)
- SRAM / SSRAM
- DRAM
- SDRAM (SDR, DDR, DDR2)
- nvSRAM
- VRAM
- EEPROM
- FLASH (NOR, NAND, SERIAL)
- FIFO
- Dual-Port RAM
- Solid State Drive (SSD)
- CUSTOM PRODUCTS
- Logic SSI to VLSI
- Gates, Microcontrollers, Bus Controllers, TTL/CMOS/ECL
- Linear / Op Amps
- Comparators, Voltage Regulators, References, Line Driver/Receivers
- Mixed-Signal
- DAC's/ADC's, Analog Switches, Multiplexers
- Discretes
- Diodes/Diode Arrays
- Transistors/Transistor Arrays
- MOSFET's /HEXFET's
- SCR's/Triac's
- Hall Effect Switches
- SiC JFETs & Diodes
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PACKAGING CAPABILITIES
- THROUGH-HOLE
- Metal Can
- Pin Grid Array (PGA)
- Zig-Zag in-line (ZIP)
- Ceramic Dual-In-Line Package (CDIP)
- SURFACE MOUNT (SMT)
- Ceramic Leadless Chip Carrier (CLCC)
- Ceramic Flat Pack (FP)
- Ceramic Gull-Wing, Leaded Package
- Ceramic Flatpack (CQFP)
- Plastic, Small-Outline, J-leaded (CSOJ)
- Plastic, Thin Quad Flat Package (TQFP)
- Plastic Ball Grid Array (PBGA)
- Radiation Tolerant Shielded Packages
- OTHER PACKAGES PER REQUIREMENT
BUSINESS SERVICES
- Die Banking and Parts Management
- Total Turnkey Manufacturing
- DMS / Obsolescence support
- Flexible, Personalized Customer Support
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PREVIOUS CUSTOM PRODUCTS BY MICROSS
For over 22 years, Micross has manufactured over 2,500 different custom products, for hundreds of customers, in the Hi-Rel / Military and Aerospace market. These products span a broad range of different types of electronic components and many types of packages.
The products listed below are a small representation of the complete custom products list manufactured by Micross. Although many of these products have long since passed, they have given Micross vast experience and capability, which are traits that exalt confidence in handling any custom requirement.
Click here to view a list of previous custom products.