COTS / iPEMS Products - New Copper Lead Frame Versions

Micross Components' long-term experience and knowledge in product engineering and test, and support of the Hi-Rel community, has lead to the development of our "COTS" (Commercial Off The Shelf) and our "iPEM" (integrated Plastic Encapsulated Microcircuit) device family.
Parts are tested to Industrial, Extended, and Military temperature ranges, with burn-in and temperature cycling available as requested. Reliability is ensured by leveraging off the OEM supplier's qualification as a complement to Micross' own qualification, and is based on 22+ years experience producing products to Military and other Hi-Rel specifications.
Micross provides this rigorous, value-added up-screening with the Hi-Reliability socket/platform in mind, yet meeting or exceeding the guidelines of the Perry Initiative.
- Copper Lead Frames - NEW!
- SDRAM
- SDR: 64Mb, 128Mb, 256Mb & 512Mb; 3.3V
Packaging: TSOPII-54 (New Copper & Alloy 42 lead frame options)
- iPEM SDR: 1.2Gb; 3.3V
Packaging: PBGA-219 (25mm x 32mm)
- DDR: 512Mb; 2.5V
Packaging: TSOPII-66
- MDDR (Mobile DDR): 1Gb; 1.8V
Packaging: PBGA-90
- iPEM DDR: 1.2Gb & 2.4Gb; 2.5V
Packaging: PBGA-219 (25mm x 32mm)
- iPEM DDR2: 2.1Gb, 2.4Gb, 4.1Gb & 4.8Gb; 1.8V
Packaging: PBGA-255 (25mm x 32mm)
- SSRAM (Sync SRAM)
- 4Mb to 36Mb; 3.3V
Pipelined, Flow-Through and ZBL(No BL)
Packaging: TQFP-100 (New Copper & Alloy 42 lead frame options)
- SRAM (Asynchronous)
- 256Kb to 64Mb; 5V and 3.3V
Packaging: SOJ & TSOP (New Copper & Alloy 42 lead frame options)
- Non-Volatile
- FLASH: 4Mb, 16Mb & 128Mb
Packaging: TSOP-32, TSOP-48 & TSOP-56
- nvSRAM: 4Mb; 3.3V
Packaging: TSOP-44
- Solid State Drive (SSD)
- microSSD: ATA/IDE/PIO Mode-6, 4Gb, 8Gb, & 16Gb; 3.3V
Packaging: PBGA-91 (14mm x 24mm x 1.3mm to 1.8mm)
COTS/iPEMS Design
Click Here For COTS/iPEMS Design Support.
LITERATURE
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